Organic electro-optic device and method for making the same

ABSTRACT

The present invention directed to an organic light emitting device and method for making the same. The method comprises the steps of: forming a first component comprising at least one first material on a first substrate; forming a second component comprising at least one second material on a second substrate, wherein at least one opening is formed through the second component; forming a third component; and laminating the first component, the second component and the third component together such that the second component is located between the first component and the third component, the at least one first material and the at least one second material form at least part of an organic electro-optic device located between the first substrate and the second substrate, the third component is bonded to the second component, and the third component is bonded to the first component through the at least one opening.

BACKGROUND OF THE INVENTION

The present invention relates generally to the field of electro-optics,and more particularly to an organic electro-optic device and method formaking the same.

Organic electro-optic devices include organic light emitting devices(OLEDs) and organic photovoltaic devices, for example. An OLED typicallycomprises one or more semi-conducting organic thin films sandwichedbetween two electrodes, one of which is usually transparent. When aforward bias is applied, injected electrons and holes recombine in theorganic layers to generate light. Organic light emitting devices havegreat potential in the display and lighting industry. Due to theirincreased brightness, faster response time, lighter weight and lowerpower consumption, OLED displays are expected to replace liquid crystaldisplay (LCD) applications in the near future.

Another type of organic electro-optic device is a photovoltaic device. Aphotovoltaic cell typically comprises a pair of electrodes and alight-absorbing photovoltaic material disposed therebetween. When thephotovoltaic material is irradiated with light, electrons that have beenconfined to an atom in the photovoltaic material are released by lightenergy to move freely. Thus, free electrons and holes are generated. Thefree electrons and holes are efficiently separated so that electricenergy is continuously extracted. An organic photovoltaic devicetypically has a similar material composition and/or structure as an OLEDyet performs an opposite energy conversion process.

Organic light emitting devices are traditionally fabricated in a batchprocess by sequentially depositing the organic thin films followed by athin metal cathode onto a transparent, anode-bearing substrate such asglass or a flexible plastic. A number of disadvantages exist with thismanufacturing approach, however. For example, one or more vacuumprocesses are typically necessary to facilitate deposition of theorganic materials and/or the metal electrode(s). The presence of vacuumprocesses greatly increases the cost of the much desired roll-to-roll(R2R) process where a roll of substrate can be continuously convertedinto a roll of product. In addition, since the cathode metal and activematerials in an OLED are sensitive to air and water vapor and degraderapidly if left unpackaged, it is often necessary to encapsulatetraditionally fabricated devices in an inert gas ambient. These extrapackaging process steps are typically lengthy and costly. With thetraditional deposition processes, it can also be difficult to producereliable OLED products with large area. Due to the vacuum process, thesize of an OLED product manufactured with traditional methods is usuallylimited by the size of the high-vacuum equipment.

These and other drawbacks exist in known systems and techniques.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to an organic electro-optic device andmethod for making the same that overcome these and other drawbacks ofknown systems and methods. Though only organic light emitting devicesand methods for making the same will be described hereinafter, it shouldbe noted that embodiments of the present invention may apply to alltypes of organic electro-optic devices, including light emittingdevices, photovoltaic devices and photo-detectors.

According to an exemplary embodiment, the invention relates to a methodfor making an electro-optic device comprising the steps of: forming afirst component comprising at least one first material on a firstsubstrate; forming a second component comprising at least one secondmaterial on a second substrate, wherein at least one opening is formedthrough the second component; forming a third component; and laminatingthe first component, the second component and the third componenttogether such that the second component is located between the firstcomponent and the third component, the at least one first material andthe at least one second material form at least part of an organicelectro-optic device located between the first substrate and the secondsubstrate, the third component is bonded to the second component, andthe third component is bonded to the first component through the atleast one opening.

According to another exemplary embodiment, the invention relates to anelectro-optic device comprising a first component comprising at leastone first material on a first substrate; a second component comprisingat least one second material on a second substrate, wherein there is atleast one opening formed through the second component; and a thirdcomponent; the first component, the second component and the thirdcomponent being laminated together such that the second component islocated between the first component and the third component, the atleast one first material and the at least one second material form atleast part of an organic electro-optic device located between the firstsubstrate and the second substrate, the third component is bonded to thesecond component, and the third component is bonded to the firstcomponent through the at least one opening.

According to yet another exemplary embodiment, the invention relates toan electro-optic device comprising a first component comprising at leastone first material on a first substrate; a second component comprisingat least one second material on a second substrate; and a thirdcomponent, where the first component and the third component are largerin area than the second component; the first component, the secondcomponent and the third component being laminated together such that thethird component is bonded to the first component in locations that arebeyond the edges of the second component, the second component islocated between and encapsulated by the first component and the thirdcomponent, and the at least one first material and the at least onesecond material form at least part of an organic electro-optic devicelocated between the first substrate and the second substrate.

According to still another exemplary embodiment, the invention relatesto an organic light emitting device comprising at least one compositelayer, wherein the at least one composite layer comprises at least oneorganic light emissive material mixed with at least one adhesivematerial.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to facilitate a fuller understanding of the present invention,reference is now made to the appended drawings, in which like elementsare referenced with like numerals. These drawings should not beconstrued as limiting the present invention, but are intended to beexemplary only.

FIG. 1 is a flow chart illustrating an exemplary method for making anorganic light emitting device according to an embodiment of theinvention.

FIG. 2 illustrates a cross-sectional view of an organic light emittingdevice and method for making the same according to an exemplaryembodiment of the invention.

FIG. 3 illustrates a cross-sectional view of another organic lightemitting device and method for making the same according to an exemplaryembodiment of the invention.

FIG. 4 illustrates a cross-sectional view of yet another organic lightemitting device and method for making the same according to an exemplaryembodiment of the invention.

FIG. 5 illustrates a cross-sectional view of still another organic lightemitting device according to an exemplary embodiment of the invention.

FIG. 6 illustrates a performance comparison between two organic lightemitting devices according to an exemplary embodiment of the invention.

FIG. 7 illustrates a cross-sectional view of one organic light emittingdevice according to an exemplary embodiment of the invention.

FIG. 8 illustrates an exemplary organic light emitting device accordingto an embodiment of the present invention.

FIG. 9 illustrates another exemplary organic light emitting deviceaccording to an embodiment of the present invention.

FIG. 10 illustrates yet another exemplary organic light emitting deviceaccording to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the exemplary embodiments of theinvention, which are illustrated in the accompanying drawings.

FIG. 1 is a flow chart illustrating an exemplary method for making anorganic light emitting device according to an embodiment of theinvention. The following description, in connection with FIG. 1,provides an overview of the exemplary method. More detailed descriptionof exemplary embodiments of the present invention will be provided belowin connection with FIGS. 2 through 6.

The exemplary method starts at step 100.

At step 102, a first component of an organic light emitting device maybe formed. For example, a first substrate may be provided and coatedwith one or more layers of OLED materials. The OLED materials mayinclude one or more of an organic light emissive material, a chargetransport material or an electrode material, for example, in any desiredcombination. In one embodiment of the present invention, the firstsubstrate itself may comprise one or more OLED materials. For example,the substrate may comprise indium tin oxide (ITO) or a metal foil. Thefirst substrate, with or without thin film coatings, forms a firstcomponent for the organic light emitting device. Examples ofelectroluminescent (EL) materials that may be used in the first orsecond component include oligomers and polymers having a conjugatedbackbone, such as poly(p-phenylene vinylenes), polyphenylenes,polythiophene, polyquinolines, polyfluorenes, and their derivatives andmixtures. A second class of EL materials include oligomers and polymersnot having a conjugated backbone, such as poly(vinylcarbazole). A thirdclass of EL materials include oligomers and polymers having anon-conjugated backbone with chromophores side chains, such aspolystyrene with quaterphenylene segments. A fourth class of ELmaterials include oligomers and polymers having a non-conjugatedbackbone with isolated chromophores, such aspoly(disilanyleneoligothienylene). A fifth class of EL materials are lowmolecular weight semiconducting materials, mainly organo-metaliccomplexes, such as tris(8-quinolinolato)aluminum and its derivatives,and organic fluorescence dyes, such as coumarin. The above mentionedmaterials can be used alone or in any combination with others.

At step 104, a second component of the organic light emitting device maybe formed. The second component may comprise a second substrate coatedwith one or more OLED materials (as described above) that, together withthe OLED materials of the first component, may form the core structureof an organic light emitting device. According to one embodiment of thepresent invention, the second substrate itself may comprise one or moreOLED materials. Depending on the desired structure, the material typesand properties of the first substrate, the second substrate and the OLEDmaterials coating the first and second substrates may be determinedbefore step 102. The appropriate substrate preparation techniques andcoating techniques may also be selected accordingly.

According to embodiments of the present invention, one or more openingsmay be formed through the second component. The openings may be etchedor laser drilled or formed with any available techniques known in theart. The openings may be holes, lines or any other shapes depending onspecific uses. These openings may be formed before or after depositionof the OLED materials on the second substrate. According to oneembodiment of the present invention, the openings may be substantiallyperpendicular to the second substrate. The openings in the secondcomponent may serve to enhance adhesion and/or to provide a passage forelectrical interconnections among the OLED components. According toanother embodiment, the pattern of the openings, i.e. the number, shapeand locations of the openings, may be varied depending on the desireduse of the openings. For example, the openings may be regularly spacedto form a grid pattern.

At step 106, a third component of the organic light emitting device maybe formed. The third component typically comprises a third substratecoated with one or more layers of adhesive materials that are capable offorming a strong mechanical bond to other materials, such as those ofthe second component and the first component. According to oneembodiment of the present invention, the adhesive material may be athermoplastic film or other suitable organic materials, such as epoxies,acrylates, acrylimide, isocyanates, polyurethanes, melamine formaldehydeand unsaturated polyesters. According to another embodiment of thepresent invention, an electrically conductive adhesive material, such asa conductive epoxy, may be used to provide interconnection among theOLED components and/or layers.

At step 108, the three components of the organic light emitting devicemay be laminated together to form an OLED product. The laminationprocess may involve application of heat, pressure and/or ultraviolet(UV) irradiation, if desired. According to one embodiment of theinvention, a commercially available roller laminator, such as theAttalam™ 110L manufactured by Attalus High Tech Industry S.A., can beused. The Attalam™ 110L laminator has four silicon rollers and anadjustable temperature range between room temperature and 160° C. Thelamination process may be performed such that the second component islocated between the first and third component, the OLED materials on thefirst and second substrates form at least part of an OLED core structurebetween these two substrates, and the third component is bonded to thesecond substrate in non-opening areas and to the first component throughthe openings. The three components may be laminated togethersimultaneously in one step or they may be laminated in a two-stepprocess where two of the components are laminated before the remainingcomponent is laminated or otherwise attached thereto. A roller laminatorwith appropriate temperature and pressure settings may be used tolaminate the components.

The exemplary method ends at step 110.

Exemplary embodiments of the present invention may provide a number ofadvantages. For example, since the three components of an organic lightemitting device may be prefabricated with or without any vacuum processand the lamination process does not require a vacuum environment, theefficiency of the OLED fabrication process may be greatly improved andthus the related costs may be reduced. And due to the nature of thefabrication method taught in embodiments of the present invention,large-area (e.g., 6 inch by 6 inch and above) organic light emittingdevices with multiple layers may be achieved, where, by selection ofappropriate OLED materials, desirable electrical, optical and/ormechanical properties may be obtained. The openings in the secondcomponent may help to reduce the possibility of trapped gas bubbles andcreate intimate organic contact among the organic layers duringlamination. In a finished OLED product made according to embodiments ofthe present invention, the OLED core structure is already protected bythe first and second substrates. Therefore, any requirements for ahermetic sealing may have already been met without any extra packagingsteps. Another advantage is that the light-extraction efficiency of theorganic light emitting device may be further enhanced by properlyengineering the structure and/or material of the third component. Forexample, the third component may be engineered and structured to containscattering particles with desirable sizes and loadings in order toenhance the light-extraction.

According to embodiments of the present invention, in order to meetdifferent specifications of an OLED product, the substrates of the threecomponents may be varied. For example, the substrate of the thirdcomponent may be designed to comprise one or more layers ofcolor-modifying materials that can tune or convert the emission colorsof the OLED product. For example, the substrate of the third componentmay include color-modifying materials such as one or more phosphors.According to one embodiment, the substrate of the third componentcomprises a down-conversion phosphor system comprising perylene orange,perylene red and inorganic phosphor particles, for example, to covertblue light into white light.

FIG. 2 illustrates a cross-sectional view of an organic light emittingdevice and method for making the same according to an exemplaryembodiment of the invention. In FIG. 2, there is shown a first component21, a second component 22, and a third component 23 of an exemplaryorganic light emitting device. These components may be laminatedtogether to form an OLED product 24.

In this example, the first component 21 comprises a substrate 200 whichhas a cathode layer 202 covered by an emitter layer 204. Cathode layer202 may comprise one or more low work function metals such as magnesium(Mg) or calcium (Ca). Emitter layer 204 may include one or more organiclight emissive materials such as polyphenylenevinylene (P-PPV) orpolyfluorene (PF). These organic material layers may have been formedwith a process such as spin casting, ink jet printing, screen printing,web coating, physical vapor deposition, or other processes known in theart. The second component 22 comprises a substrate 206, an indium tinoxide (ITO) layer 208 and a polyethylenedioxythiophene (PEDOT) layer210. ITO layer 208 serves as an anode and the PEDOT layer 210 is aconducting polymer that serves as a charge transport material. Substrate206 may be a transparent glass or plastic, for example. An array ofopenings 216 may be formed through the second component 22. In thisparticular example, the openings are shown as holes drilled or etchedthrough the second component 22. The orientation of the openings may besubstantially perpendicular to the upper and lower surfaces of thesecond component 22. The third component 23 comprises a substrate 212and an adhesive layer 214. Adhesive layer 214 may be a thermoplastic orother organic material that can form a substantial bond to substrate 206as well as emitter layer 204. Thus, when components 21, 22 and 23 arelaminated together to form OLED product 24, adhesive material 214 maynot only bond to the upper surface of substrate 206 as shown in FIG. 2,but also reach through openings 216 to form a bond to the top surface ofthe first component 21, in this case emitter layer 204. As a result oflamination, the three components may be firmly integrated into onefinished product that may not easily delaminate or otherwise come aparteven if made into a large area.

FIG. 3 illustrates a cross-sectional view of another organic lightemitting device and method for making the same according to an exemplaryembodiment of the invention. In FIG. 3, there is shown a first component31, a second component 32, and a third component 33 of an exemplaryorganic light emitting device. These components may be laminatedtogether to form an OLED product 34.

In this example, the first component 31 comprises a substrate 300 whichhas an ITO layer 302 (anode) covered by a PEDOT layer 304 and an emitterlayer 306. The second component 32 comprises a substrate 308, a cathodelayer 310 and an emitter layer 312. An array of openings 318 may beformed through the second component 32. The third component 33 comprisesa substrate 314 and an adhesive layer 316. When components 31, 32 and 33are laminated together to form an OLED product 34, adhesive material 316may bond to both the upper surface of substrate 308 and the top surfaceof emitter layer 306 through openings 318.

It will be appreciated that the OLED products illustrated in FIGS. 2 and3 are only two examples in accordance with embodiments of the presentinvention. Many variations exist in the choice of OLED materials andtheir layer sequences in the core OLED structure formed in a finishedproduct. In fact, even for the same OLED product, many choices may existfor OLED materials and their layer sequences in the three componentsbefore they are laminated.

FIG. 4 illustrates a cross-sectional view of yet another organic lightemitting device and method for making the same according to an exemplaryembodiment of the invention. In FIG. 4, there is shown a first component41, a second component 42, and a third component 43 of an exemplaryorganic light emitting device, where the second component 42 is smallerthan the other two components. The first component 41 comprises asubstrate 400 which has an ITO layer 402 (anode) covered by a PEDOTlayer 404. The second component 42 comprises a substrate 408, a cathodelayer 410 and an emitter layer 412. Openings may or may not be includedin the second component 42. The third component 43 comprises a substrate414 and an adhesive layer 416. When components 41, 42 and 43 arelaminated together to form finished OLED product 44, adhesive material416 may bond to both the upper surface of substrate 408 and the topsurface of PEDOT layer 404 in locations beyond the edges of the secondcomponent 42. Due to its smaller size relative to the first and thirdcomponents 41 and 43, the second component 42 may become encapsulatedbetween components 41 and 43 after lamination. Depending on the size ofthe second component 42 as well as desired bonding strength, it may ormay not be desirable to form openings in the second component 42 priorto lamination.

FIG. 5 illustrates a cross-sectional view of still another organic lightemitting device according to an exemplary embodiment of the inventionwhere electrical interconnection is provided by adopting an adhesivematerial that is also electrically conductive. This OLED is fabricatedby laminating components 51, 52 and 53. The first component 51 comprisesa substrate 500 covered with a patterned ITO layer 502 and a patternedPEDOT layer 504. The second component 52 comprises a substrate 506, apatterned cathode layer 508 and an organic emitter layer 510. The thirdcomponent 53 comprises a non-conductive substrate 512 and a patternedconductive epoxy layer 514. When the three components are laminatedtogether, the conductive epoxy 514 may act not only as an adhesive tobond the three components together, it may also provide electricalinterconnection among the different layers of the OLED product. Thethree components and the openings may be designed to provide desiredconfigurations of the electrical interconnection. The exemplaryconfiguration of the device shown in FIG. 5 effectuates a seriallyconnected architecture. The structure may be viewed as a number ofsmaller OLEDs connected in series, where, under a proper voltage bias,current may flow from one part to another through the interconnectionpoints created by the conductive epoxy.

Another example of an interconnection configuration is shown in FIG. 7.This OLED is fabricated by laminating components 71, 72 and 73. Thefirst component 71 comprises a substrate 700 covered with an ITO layer702 and a PEDOT layer 704. The second component 72 comprises a substrate706, a patterned cathode layer 708 and an organic emitter layer 710. Thethird component 73 comprises a conductive substrate 712 and a patternedconductive epoxy layer 714. When the three components are laminatedtogether, the conductive epoxy 714 may provide electricalinterconnection between the substrate 712 and the first component 71. Inone application, substrate 712 may comprise a highly conductive metalfoil structured as a bus line to reduce the sheet resistance of the lessconductive ITO/PEDOT bi-layer anode. As a result, the structure shown inFIG. 7 may be viewed as a number of smaller OLEDs connected to the busline (or bus bar) in parallel.

The serially connected architecture and the parallel connectedarchitecture, as exemplified in FIGS. 5 and 7 respectively, may becombined in configuring electrical interconnections. Other variationsare also possible. Further, conductive adhesive materials other thanepoxy may also be used.

According to another embodiment of the present invention, it may bedesirable to add one or more adhesive materials to the active organiclayers of an organic light emitting device. The advantage of blending anemissive polymer with adhesive material(s) can be twofold. It may helpcreate more intimate contact between laminated surfaces. For example,surface contact between an emissive polymer layer and a PEDOT layer, orbetween an emissive polymer layer and a metal electrode layer, may bestrengthened. In addition, blending an emissive polymer with adhesivematerial(s) may also enhance the efficiency of an OLED. According toembodiments of the invention, a number of adhesives or theircombinations may be used. Examples of adhesives which may be usedinclude epoxies, acrylates, acrylimide, isocyanates, polyurethanes,melamine formaldehyde and unsaturated polyesters. To maintain a highlight extraction efficiency, the adhesive material selected should besubstantially transparent to the light emitted from the light emissivematerial. A composite of an adhesive mixed with an organic lightemissive material may be prepared by dissolving them into a same solventor a same mixture of two or more miscible solvents. Next, the compositemay be applied by the process of spin-coating, spray coating, dipcoating, screen printing, ink-jet printing or roller coating, forexample. The adhesive may be cured by ultra-violet (UV) irradiation orat a temperature between approximately 50° C. and approximately 250° C.Typically, in the composite, the light emissive material is the mostabundant ingredient on a weight basis.

FIG. 10 illustrates one exemplary organic light emitting deviceincorporating one or more adhesive materials according to an embodimentof the present invention. This OLED comprises a substrate 1000, an anode(ITO) layer 1002, a PEDOT layer 1004, a composite layer 1006 and acathode layer 1008. The composite layer 1006 may be formed by mixingemissive polymer ADS329 with adhesive material Norland 68.

According to one embodiment of the invention, an OLED may be fabricatedby laminating only a first and a second component when an adhesive ismixed into a polymer layer to increase the interfacial bonding betweenthe two components. In this case, a third component may not benecessary.

EXAMPLE 1

An OLED device was formed as follows. A first component comprised apolyethylene terephthalate (PET) substrate coated with an ITO layer anda PEDOT layer. A second component comprised a PET substrate coated withan ITO layer and a layer of polymer blend in which an emissive polymer,ADS329 (Poly(9,9-dioctylfluorenyl-2,7-diyl), purchased from American DyeSource, Inc. (555 Morgan Boulevard, Baie D.Urfe, Quebec, Canada H9X3T6), was blended with an adhesive material, Norland Optical Adhesive 68(“Norland 68”), purchased from Norland Products, Inc. (Cranbury, N.J.08512, U.S.A.). The first component thus had a structure ofPET/ITO/PEDOT and the second component had a structure ofPET/ITO/(polymer blend). These two components were subsequentlylaminated together followed by a short (30 seconds) exposure to UVirradiation. Before lamination, photoluminescence was only observed (dueto ADS329) from the second component. After lamination, the laminatedfilm was separated on purpose. Photoluminescence now was seen on bothsides, indicating ADS329 in the second component had been partiallytransferred onto the surface of PEDOT in the first component due to thestrengthened adhesion.

EXAMPLE 2

In another experiment, two working devices with a structure ofPET/ITO/PEDOT/(polymer blend)/Al/PET were made via lamination ofseparate components, wherein Al was an aluminum cathode layer and thepolymer blend comprised a blend of ADS329 and Norland 68. The firstdevice was made using a component with a structure ofPET/ITO/PEDOT/(polymer blend) and a component with a structure ofPET/Al. The second device was made using a component with a structure ofPET/ITO/PEDOT and a component with a structure of PET/Al/(polymerblend). The polymer blend layer was spin-coated and the laminated filmstacks were cured using a long wavelength (365 nm) UV-lamp for fiveminutes in air. Both devices showed enhanced mechanical properties, i.e.strengthened adhesion between the PEDOT and the emissive polymer, aswell as between the emissive polymer and the Al cathode.

EXAMPLE 3

In another example, emissive polymer ADS329 was mixed with adhesivematerial Norland 68. The blend solution was prepared by mixing 52milligrams of ADS329 with 19 milligrams of degassed Norland 68 in anamber vial at room temperature in air, purging the mixture in nitrogenfor 40 minutes, adding 4 milliliters of M-xylene (anhydrous), heatingthe solution at 75° C. (stirring with a stir bar) for one hour andcooling down to room temperature in a nitrogen-purged box. An organiclight emitting device (“Device A”) was fabricated following the stepsof: (1) spin-coating PEDOT onto a pre-cleaned, UV-ozoned ITO substrate;(2) baking the ITO/PEDOT substrate at 170° C. for 30 minutes and thencooling it down to room temperature in a nitrogen-purged box; (3)spin-coating the blend solution, as prepared above, onto the ITO/PEDOTsubstrate, then partially curing it with a long-wavelength (365 nm)UV-lamp for 30 seconds; (4) transferring the sample into an argon-purgedbox (moisture and oxygen less than 1 ppm); (5) thermally evaporating anddepositing the cathode materials—NaF(4 nm)/Al (100 nm) onto the sample;and (6) encapsulating the sample with a piece of cover glass withNorland 68. A similar device (“Device B”) was also fabricated with theemissive polymer but without the adhesive.

The performance of these two devices was examined in acurrent-voltage-brightness measurement and the results plotted in FIG.6. Referring to FIG. 6, curve 61 illustrates the device efficiency ofDevice A and curve 62 illustrates the device efficiency of Device B. Asshown, Device A exhibited a much higher efficiency than Device B.

EXAMPLE 4

FIG. 8 illustrates an exemplary organic light emitting device accordingto an embodiment of the present invention. This OLED was fabricated bylaminating three components, 81, 82 and 83. The first component 81 wasprepared by spin-coating a PEDOT layer 804 about 60 nm thick onto apre-cleaned and UV-ozoned PET(800)/ITO(802) substrate. Thus component 81had a structure of PET/ITO/PEDOT. The second component 82 was preparedby thermally evaporatting an 80 nm-thick Al layer 810 onto a PETsubstrate 808, and subsequently spin-coating the substrate with apolyfluorene-based light emitting polymer 812 about 80 nanometers (nm)thick. Thus component 82 had a structure of PET/Al/(emissive polymer).The third component 83 comprised a 3M™ LS851 self-laminating cardprotector 814 used as received without any treatment. The threecomponents were laminated with with an Attalam™ 110L roller laminator at130° C. The finished OLED had a structure of PET/ITO/PEDOT/(emissivepolymer)/Al/PET/(3M™ card protector). The efficiency of the devicemeasured at a constant voltage (9V) applied between electrical contacts816 and 818 was about 0.14 cd/A. In a comparison experiment, followingthe above procedures, devices were made without the third component 83.None of these devices turned out to be working due to de-lamination,which indicated that the interfacial adhesion between the first andsecond components was weak.

FIG. 9 illustrates another exemplary organic light emitting deviceaccording to an embodiment of the present invention. This OLED wasfabricated by laminating three components, 91, 92 and 93. The firstcomponent 91 was prepared by spin-coating a PEDOT layer 904 about 60 nmthick onto a pre-cleaned and UV-ozoned Glass(900)/ITO(902) substrate.Thus the component 91 had a structure of Glass/ITO/PEDOT. The secondcomponent 92 was prepared by depositing an 80 nm Al layer 910 onto a PETsubstrate 908 via thermal evaporation, spin-coating a polyfluorene-basedlight emitting polymer 912 about 80 nm thick, and forming one hole 906through the component 92 with a stationery punch. Thus the component 92had a structure of PET/Al/(emissive polymer) with a hole through it. Thethird component 93 was prepared by applying the Norland 68 adhesive 914onto a pre-cleaned cover glass 916. Thus the component 93 had thestructure of Glass/(Norland 68). The three components were laminatedtogether on a hotplate at 150° C. The finished OLED had a structure ofPET/ITO/PEDOT/(emissive polymer)/Al/(Norland 68)/Glass. The OLED wastested by applying a DC voltage between the electrical contacts 918 and920. Light emissions from the device could be turned on or off inresponse to the applied voltage.

While the foregoing description includes many details and specificities,it is to be understood that these have been included for purposes ofexplanation only, and are not to be interpreted as limitations of thepresent invention. It will be apparent to those skilled in the art thatother modifications to the embodiments described above can be madewithout departing from the spirit and scope of the invention.Accordingly, such modifications are considered within the scope of theinvention as intended to be encompassed by the following claims andtheir legal equivalents.

1. A method for making an electro-optic device, the method comprising:forming a first component comprising at least one first material on afirst substrate; forming a second component comprising at least onesecond material on a second substrate, wherein at least one opening isformed through the second component; forming a third component; andlaminating the first component, the second component and the thirdcomponent together such that the second component is located between thefirst component and the third component, the at least one first materialand the at least one second material form at least part of an organicelectro-optic device located between the first substrate and the secondsubstrate, the third component is bonded to the second component, andthe third component is bonded to the first component through the atleast one opening.
 2. The method according to claim 1, wherein theorganic electro-optic device is a light emitting device.
 3. The methodaccording to claim 1, wherein the organic electro-optic device is aphotovoltaic device.
 4. The method according to claim 1, wherein the atleast one first material or the at least one second material comprisesat least one of: an organic light emissive material; a light-absorbingphotovoltaic material; a charge transport material; and an electrodematerial.
 5. The method according to claim 1, wherein the at least onefirst material or the at least one second material comprises one or moreof the following electroluminescent materials: poly(p-phenylenevinylenes), polyphenylenes, polythiophene, polyquinolines,polyfluorenes, poly(vinylcarbazole), polystyrene with quaterphenylenesegments, poly(disilanyleneoligothienylene),tris(8-quinolinolato)aluminum, and coumarin.
 6. The method according toclaim 1, wherein the at least one opening through the second componentis substantially perpendicular to the second substrate.
 7. The methodaccording to claim 1, wherein the at least one opening through thesecond component comprises a grid of regularly spaced openings.
 8. Themethod according to claim 1, wherein the third component comprises atleast one adhesive material that forms a bond to the second componentand the first component.
 9. The method according to claim 8, wherein theat least one adhesive material comprises a thermoplastic film.
 10. Themethod according to claim 8, wherein the at least one adhesive materialcomprises one or more of: epoxy; acrylate; acrylimide; isocyanate;polyurethane; melamine formaldehyde; or unsaturated polyester.
 11. Themethod according to claim 1, wherein the third component comprises atleast one electrically conductive material that provides electricalinterconnection among the first component, the second component and thethird component through the at least one opening.
 12. The methodaccording to claim 11, wherein the at least one electrically conductivematerial comprises a conductive epoxy.
 13. The method according to claim1, wherein the third component comprises at least one color-modifyingmaterial that can modify one or more emission colors of the organiclight emitting device.
 14. The method according to claim 13, wherein theat least one color-modifying material comprises a plurality ofdown-conversion phosphor layers.
 15. The method according to claim 1,wherein the third component comprises a plurality of scatteringparticles to enhance the light-extraction efficiency of the organicelectro-optic device.
 16. The method according to claim 1, wherein thestep of laminating the first component, the second component and thethird component together comprises: laminating the first component andthe second component together to form an intermediate structure; andlaminating the third component with the intermediate structure.
 17. Themethod according to claim 1, wherein the step of laminating the firstcomponent, the second component and the third component togethercomprises: laminating the second component and the third componenttogether to form an intermediate structure; and laminating the firstcomponent with the intermediate structure.
 18. The method according toclaim 1, where the first component or the second component comprises atleast one organic light emissive material mixed with at least oneadhesive material.
 19. An electro-optic device comprising: a firstcomponent comprising at least one first material on a first substrate; asecond component comprising at least one second material on a secondsubstrate, wherein there is at least one opening formed through thesecond component; and a third component; the first component, the secondcomponent and the third component being laminated together such that thesecond component is located between the first component and the thirdcomponent, the at least one first material and the at least one secondmaterial form at least part of an organic electro-optic device locatedbetween the first substrate and the second substrate, the thirdcomponent is bonded to the second component, and the third component isbonded to the first component through the at least one opening.
 20. Theelectro-optic device according to claim 19, wherein the organicelectro-optic device is a light emitting device.
 21. The electro-opticdevice according to claim 19, wherein the organic electro-optic deviceis a photovoltaic device.
 22. The electro-optic device according toclaim 19, wherein the at least one first material or the at least onesecond material comprises at least one of: an organic light emissivematerial; a light-absorbing photovoltaic material; a charge transportmaterial; and an electrode material.
 23. The electro-optic deviceaccording to claim 19, wherein the at least one first material or the atleast one second material comprises one or more of the followingelectroluminescent materials: poly(p-phenylene vinylenes),polyphenylenes, polythiophene, polyquinolines, polyfluorenes,poly(vinylcarbazole), polystyrene with quaterphenylene segments,poly(disilanyleneoligothienylene), tris(8-quinolinolato)aluminum, andcoumarin.
 24. The electro-optic device according to claim 19, whereinthe at least one opening through the second component is substantiallyperpendicular to the second substrate.
 25. The electro-optic deviceaccording to claim 19, wherein the at least one opening through thesecond component comprises a grid of regularly spaced openings.
 26. Theelectro-optic device according to claim 19, wherein the third componentcomprises at least one adhesive material that forms a substantial bondto the second substrate and the first component.
 27. The electro-opticdevice according to claim 26, wherein the at least one adhesive materialcomprises a thermoplastic film.
 28. The electro-optic device accordingto claim 26, wherein the at least one adhesive material comprises one ormore of: epoxy; acrylate; acrylimide; isocyanate; polyurethane; melamineformaldehyde; or unsaturated polyester.
 29. The electro-optic deviceaccording to claim 19, wherein the third component comprises at leastone electrically conductive material that provides electricalinterconnection among the first component, the second component and thethird component through the at least one opening.
 30. The electro-opticdevice according to claim 29, wherein the at least one electricallyconductive material comprises a conductive epoxy.
 31. The electro-opticdevice according to claim 19, wherein the third component comprises atleast one color-modifying material that can modify one or more emissioncolors of the organic light emitting device.
 32. The electro-opticdevice according to claim 31, wherein the at least one color-modifyingmaterial comprises a plurality of down-conversion phosphor layers. 33.The electro-optic device according to claim 19, wherein the thirdcomponent comprises a plurality of scattering particles to enhance thelight-extraction efficiency of the electro-optic device.
 34. Theelectro-optic device according to claim 19, where the first component orthe second component comprises at least one organic light emissivematerial mixed with at least one adhesive material.
 35. A method formaking an electro-optic device, the method comprising: forming a firstcomponent comprising at least one first material on a first substrate;forming a second component comprising at least one second material on asecond substrate; forming a third component, where the first componentand the third component are larger in area than the second component;and laminating the first component, the second component and the thirdcomponent together such that the third component is bonded to the firstcomponent in locations that are beyond the edges of the secondcomponent, the second component is located between and encapsulated bythe first component and the third component, and the at least one firstmaterial and the at least one second material form at least part of anorganic electro-optic device located between the first substrate and thesecond substrate.
 36. The method according to claim 35, wherein theorganic electro-optic device is a light emitting device.
 37. The methodaccording to claim 35, wherein the organic electro-optic device is aphotovoltaic device.
 38. An electro-optic device comprising: a firstcomponent comprising at least one first material on a first substrate; asecond component comprising at least one second material on a secondsubstrate; a third component, where the first component and the thirdcomponent are larger in area than the second component; the firstcomponent, the second component and the third component being laminatedtogether such that the third component is bonded to the first componentin locations that are beyond the edges of the second component, thesecond component is located between and encapsulated by the firstcomponent and the third component, and the at least one first materialand the at least one second material form at least part of an organicelectro-optic device located between the first substrate and the secondsubstrate.
 39. The electro-optic device according to claim 38, whereinthe organic electro-optic device is a light emitting device.
 40. Theelectro-optic device according to claim 38, wherein the organicelectro-optic device is a photovoltaic device.
 41. A method for makingan organic light emitting device, the method comprising: forming atleast one composite by mixing at least one organic light emissivematerial with at least one adhesive material; and forming an organiclight emitting device using the at least one composite as a layer in theorganic light emitting device.
 42. The method according to claim 41,wherein the at least one adhesive material and the at least one organiclight emissive material are soluable in a same solvent or a mixture ofat least two miscible solvents.
 43. The method according to claim 41,wherein the at least one composite is formed by a method selected from agroup consisting of spin-coating, spray coating, dip coating, screenprinting, ink-jet printing and roller coating.
 44. The method accordingto claim 41, wherein the at least one adhesive material is transparentto a light emitted from the at least one organic light emissivematerial.
 45. The method according to claim 41, wherein the at least oneadhesive material is cured under an ultra-violet (UV) irradiation. 46.The method according to claim 41, wherein the at least one adhesivematerial is cured at a temperature between approximately 50° C. andapproximately 250° C.
 47. The method according to claim 41, wherein theat least one organic light emissive material is the most abundantmaterial on a weight basis in the at least one composite.
 48. An organiclight emitting device comprising at least one composite layer, whereinthe at least one composite layer comprises at least one organic lightemissive material mixed with at least one adhesive material.
 49. Theorganic light emitting device according to claim 48, wherein the atleast one organic light emissive material comprises one or more of:poly(p-phenylene vinylenes), polyphenylenes, polythiophene,polyquinolines, polyfluorenes, poly(vinylcarbazole), polystyrene withquaterphenylene segments, poly(disilanyleneoligothienylene),tris(8-quinolinolato)aluminum, and coumarin.
 50. The organic lightemitting device according to claim 48, wherein the at least one adhesivematerial comprises one or more of: epoxy; acrylate; acrylimide;isocyanate; polyurethane; melamine formaldehyde; or unsaturatedpolyester.
 51. The organic light emitting device according to claim 48,wherein the at least one adhesive material and the at least one organiclight emissive material are soluable in a same solvent or a mixture ofat least two miscible solvents.
 52. The organic light emitting deviceaccording to claim 48, wherein the at least one composite is formed by amethod selected from a group consisting of spin-coating, spray coating,dip coating, screen printing, ink-jet printing and roller coating. 53.The organic light emitting device according to claim 48, wherein the atleast one adhesive material is transparent to a light emitted from theat least one organic light emissive material.
 54. The organic lightemitting device according to claim 48, wherein the at least one adhesivematerial is cured under an ultra-violet (UV) irradiation.
 55. Theorganic light emitting device according to claim 48, wherein the atleast one adhesive material is cured at a temperature betweenapproximately 50° C. and approximately 250° C.
 56. The organic lightemitting device according to claim 48, wherein the at least one organiclight emissive material is the most abundant material on a weight basisin the at least one composite.